Description
High temperature polyimide adhesive tape designed for micro-soldering operations and protection of sensitive components during hot air rework.
- Material: high-density polyimide film
- Adhesive: silicone with high heat resistance
- Size: 20 mm x 22 m
- Thermal resistance: 260°C continuous / 300°C short exposure
- Thickness: 0.05 mm
- Properties: anti-static, electrical insulator, solvent resistant
- Color: transparent amber for good board visibility
Suitable for masking plastic connectors, fragile flex cables and integrated circuits, while also helping secure small passive components during hot air work. It can also be used as a permanent insulating layer for jumper repairs or for protection against moisture and internal short circuits.
For increased thermal protection during CPU or NAND removal, a first layer of polyimide tape can be combined with a layer of aluminum adhesive tape. Remove the tape only after the board returns to room temperature.









