Description
Kapton polyimide thermal adhesive tape, 6 mm wide and 30 m long, designed for micro-soldering, insulation and heat protection in smartphone, wearable and electronics repair.
The narrow 6 mm format allows highly precise masking of sensitive motherboard areas, including FPC connectors, passive components, chips and other tightly spaced parts. It is suitable for protecting nearby components during hot air work and for securing or electrically insulating thin wire jumpers after trace repair.
Material: polyimide film. Adhesive: high-performance silicone. Thermal resistance: 260°C stable / 300°C peak. Thickness: 0.05 mm. Properties: high dielectric insulation, chemical resistance, non-flammable material, clean adhesive with no sticky residue left on the PCB.









